HERMITICITY OF ELECTRONIC PACKAGES PDF

HERMITICITY OF ELECTRONIC PACKAGES PDF

Six Sigma: Hermeticity Testing (Fine and Gross Leak) is used to determine the 1] H. Greenhouse, Hermeticity of Electronic Packages (William Andrew. As early as the s, SCHOTT’s Business Unit Electronic Packaging .. glass seal, for instance, hermeticity or seal strength, do not change as a result of. Electronic packaging is the design and production of enclosures for electronic devices ranging . Burn-in · Temperature cycling · Thermal shock · Solderability · Autoclave; Visual inspection; Hermeticity/moisture resistance.

Author: Malagal Gugis
Country: Cape Verde
Language: English (Spanish)
Genre: Life
Published (Last): 16 January 2008
Pages: 72
PDF File Size: 1.16 Mb
ePub File Size: 10.12 Mb
ISBN: 162-3-42313-537-3
Downloads: 21313
Price: Free* [*Free Regsitration Required]
Uploader: Tujind

Electronic packages are sometimes made by machining solid blocks of metal, usually aluminum, into complex shapes. Pl can be post-processed to provide conductive surfaces. A designer must balance many objectives and practical considerations when selecting packaging methods. Examples are integrated circuit chips in ceramic Dual In-line Package form, or complex hybrid assemblies of chip components on a ceramic base plate. Packaging for aerospace, marine, or military systems imposes different types of design criteria.

Liquid filling is sometimes used as an alternative to potting or impregnation.

There was a problem providing the content you requested

Retrieved from ” https: It prevents ionization from forming between closely spaced live surfaces and initiating failure. Quantities tend to be small; sometimes only one unit of a custom design is required. In the design of electronic products, electronic packaging engineers perform analyses to estimate such things as maximum temperatures hemriticity components, structural resonant frequencies, and dynamic stresses and deflections under worst-case environments.

Many electrical products require the manufacturing of high-volume, low-cost parts electroinc as enclosures or covers by techniques such as injection molding, die casting, investment casting, and so on. Glop-top is a variant of off coating used in chip-on-board assembly COB. The main application of vacuum impregnation porosity sealing is in boosting the dielectric strength of transformers, solenoids, lamination stacks or coils, and some high voltage components.

Another use is to protect deep-submergence items such as sonar transducers from collapsing under extreme pressure, by filling all voids.

  DEFINICION DE POLICONTUNDIDO PDF

The same electronic system may be packaged as a portable device or adapted for fixed mounting in an instrument rack or permanent installation. Punched and formed sheet metal is one of the oldest types of electronic packaging. Piece part costs are high, but there is little or no cost for custom tooling, and first-piece deliveries can take as little as half a day. This industry developed the glass-seal electrical feedthrough, using alloys such as Kovar to match the coefficient of expansion of the sealing glass so as to minimize mechanical stress on the critical metal-glass bond as the tube warmed up.

When void-free potting is required, it is common practice to place the product in a vacuum chamber while the resin is still liquid, hold a vacuum for several minutes to draw the air out of internal cavities and the resin itself, then release the vacuum.

hermitiity Articles needing additional references from December All articles needing additional references. Atmospheric pressure collapses the voids and forces the liquid resin into all internal spaces. It provides mechanical and chemical protection pacjages delicate components. Electronic packaging is a major discipline within the field of mechanical engineering. Gasketed metal castings are sometimes used to package electronic equipment for exceptionally severe environments, such as in heavy industry, aboard ship, or deep under water.

It is most commonly used in electronic toys and low-end devices.

The pressure above the fluid is lowered to a full vacuum. They are fairly common in microwave assemblies for aerospace use, where precision transmission eletronic require complex metal shapes, in combination with hermetically sealed housings.

It’s relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc. Aluminum packges castings are more common than iron or steel sand castings. From Wikipedia, the free encyclopedia.

Electronic packaging – Wikipedia

Vacuum potting works best with resins that cure by polymerization, rather than solvent evaporation. This article needs additional citations for verification. These requirements extend beyond and interact with the electrical design. This also excludes dirt and conductive contaminants such hermiticiry impure water from sensitive areas. The tool of choice is a numerically controlled vertical milling machine, with automatic translation of computer-aided design CAD files to toolpath command files.

  GITA BHASHYA SHANKARACHARYA PDF

Six Sigma: Hermeticity Testing

After the vacuum is released, the fluid flows into the part. Parts are submerged in a polymerizable monomer or solvent-based low viscosity plastic solution. See Conformal coatingParylene. It can be mechanically strong, provides electromagnetic shielding when the product requires that feature, and is easily made for prototypes and small production runs with little custom tooling expense.

Liquid filling can be removed for repair much more easily than potting. Conformal coating is a thin insulating coating applied by various methods.

Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. It can be very economical, but somewhat difficult to achieve consistent process quality. In earlier times it was often used to discourage reverse engineering of proprietary products built as printed circuit modules. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge.

Potting can be rigid or soft.

This method is used mostly in very large electrical equipment such as utility transformers, to increase breakdown voltage. Hermetic metal packaging began life in the vacuum tube industry, where a totally leak-proof housing was essential to operation.

Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology. In some products, such as computer accessory boards, they’re all the structure there is. Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor oof up to complete systems such as a mainframe computer. Unsourced material may be challenged and removed.

Formally called “encapsulation”, potting consists of immersing the part or assembly in a liquid resin, then curing it. Some parts may be manufactured by specialized processes such as plaster- and sand-casting of metal enclosures.

Previous post: